This checker demonstrates its full capability for improving and controlling the soldering process of materials placed under microsoldering with highprecision, handy and secure operations coping with the present-day techniques of using chips everywhere as well as SMT soldering process.

适用标准
  IEC 60068-2-54(Solderability testing by the wetting balance method)
　JIS C 0050 (检查solderability 方法)
　JIS C 0053 (检查(平衡的方法) solderability 方法)
　JIS C 0054 (SMD) solderability
　MIL-STD-202 方法208 (Solderability)
　MIL-STD-883 方法2003 年(Solderability)
　MIL-STD-883 方法2022 年(wetting 平衡Solderability)
　EIAJ ET-7401 (solderability 方法)

J-STD-002

J-STD-003

IPC-TM-650

IPC-S-805A

JIS Z3198

ISO/FIDS 9455

DIN等

GB/T 20422-2006 (无铅焊料Lead-free solders)